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      Universal Scientific Industrial

      微小化

      微小化现今变得更加重要,特别是对于移动设备,物联网(IoT)和可穿戴电子产品。通过我们微小化解决方案,可以减小大多数电子系统尺寸以满足市场需求。

      微小化技术带来的优点。

      • 降低材料成本
      • 可整合更多的功能
      • 更便于携带或运输
      Universal Scientific Industrial

      微小化

      There are four key technologies about how to reduce XY Area.

      • Use small foot print components: such as 01005 passive SMDs, fine pitch WLCSP, QFN IC package and reduce components space. This is "High Density SMT Technology”.
      • Put components on both sides of substrate with special package architectures. This is "Dual Side Molding Technology”.
      • Stack memory chips together on memory controller IC and wire bond together. This is "3D Stack Die Technology”.
      • Bury SMDs or IC chips inside substrate layers can reduce XY Area also. This is "Embedded in Substrate Technology”.

      High Density SMT

      • Universal Scientific Industrial

        High Density SMT

      Universal Scientific Industrial

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      Universal Scientific Industrial
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